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Conference


 

Interconnects Reliability

1.       J. M. Chan, C. M. Tan, K. C. Lee, W. Kanert, C. S. Tan, "Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability Evaluation", International Conference on Materials for Advanced Technologies, Singapore, 28 June, 2015.

2.       Cher Ming Tan and Udit Narula, “Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test”, 2014 12th IEEE International Conference on Solid State and Integrated Circuits Technology(ICSICT), Guilin, China, 28-31 Oct., 2014, pp.1-7.  Doi: 10.1109/ICSICT.2014.7021168

3.     Cher Ming Tan, “Extending electromigration modeling from test structures to Integrated circuit layout level”, Invited talk in International Reliability Physics Symposium, 2014, USA

4.     J. Zhang, K. Ghosh, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan, “TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current,” in Int. Conf. on Solid State Devices and Materials, Kyoto, Japan, 25-27th Sep. 2012.

5.     K. Ghosh, J. Zhang, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan, “Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay,” in Int. Microsystems, Packaging, Assembly Circuits Technology Conf., Taipei, Taiwan, 24-26th Oct. 2012.

6.     C. M. Tan and C. Fu. “Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk),” in Proc. of IEEE ICSICT, Xi’an, China, 29th Oct. - 1st Nov. 2012.

7.     W. Li and C. M. Tan. “Black’s equation for today’s ULSI interconnect electromigration (invited),” in Proc. of IEEE Electron Devices and Solid State Circuits, China, 2011.

8.     C. M. Tan, Z. Gan, and W. Li. “Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited Talk),” presented at Int. Conf. on Materials for Advanced Technologies, Singapore, Jul. 2011.

9.     S. M. L Nai, Y. D. Han, H. Y. Jing, L. Y. Xu, C. M. Tan, and J. Wei. “Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes,” in IEEE Electronics Packaging Technology Conf., 2010.

10.   Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei. “Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes,” in IEEE Int. Nanoelectronic Conf., Hong Kong , 2010, pp. 292-295.

11.   Y. Hou and C. M. Tan. “Requirement for accurate interconnect temperature measurement for Electromigration test,” in IEEE Int. Symp. on Integrated Circuits, Singapore, 2009.

12.   S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, and J. Wei. “Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes,” in Int. Conf. on Electronic Packaging Technology & High Density Packaging, China, 2009, pp. 540-543.

13.   Y. D. Han, S. M. L Nai, Y. C. Liu, C. M. Tan, and J. Wei. “Indentation size effect on the hardness of a Sn-Ag-Cu Solder,” in Int. Mechanical Engineering Congress and Exposition, 2009.

14.   Y. D. Han, H. Y. Jing, S. M. L. Nai, Y. C. Liu, C. M. Tan, J. Wei, and L. Y. Xu. “Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes,” in Int. Conf. on Materials for Advanced Technologies, 2009.

15.   Y. D. Han, H. Y. Jing, S. M. L. Nai, Y. C. Liu, C. M. Tan, J. Wei, and L.Y. Xu. “Indentation size effect on the creep behavior of a Sn-Ag-Cu solder,” in Int. Conf. on Materials for Advanced Technologies, 2009.

16.   C. M. Tan and Y. Liu. “Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system,” Tutorial in IEEE Int. Electronic Packaging and Technology Conf., 2008.

17.   Y. Hou and C. M. Tan. “The multiple temperature heater platforms for solder Electromigration test conducted at room temperature,” in IEEE Electronics Packaging Technology Conf., Singapore, 2008.

18.   Y. D. Han, C. M. Tan and W. Jun. “A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress,” in IEEE Electronics Packaging Technology Conf., Singapore, 2008.

19.   P. Cheng, A. Lee, Z. X. Lim, N. Yantara, S. Z. Y. Loo, T. Y. Tee, C. M. Tan and Z. Chen. “Fracture Toughness Assessment of a solder joint using double cantilever beam specimens,” in IEEE Electronics Packaging Technology Conf., Singapore, 2008.

20.   C. M. Tan and W. Li. “A holistic numerical modeling for interconnect electromigration,” (invited) presented at Int. Materials Research Society Conf., Chongqing, China, Jun. 2008.

21.   Y. Hou and C. M. Tan. “Size effect in Cu nano-interconnects and its implication on electromigration,” presented at IEEE Int. Nanoelectronics Conf., Shanghai, China, Mar. 2008.

22.   W. Li and C. M. Tan. “Enhanced finite element modelling of Cu electromigration using ANSYS and Matlab,” in European Symp. on Reliability of Electron Devices, Failure physics and analysis, 2007.

23.   C. M. Tan. “Electromigration in ULSI Interconnection (keynote),” in 1st Microreliability and Nanoreliability Congress, 2007.

24.   Y. Hou and C. M. Tan. “Blech effect in Cu interconnects with oxide and low-k dielectrics,” in Int. Symp. on physical and failure analysis of integrated circuits, 2007.

25.   A. Roy and C. M. Tan. “Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect,” in European Symp. on Reliability of Electron Devices, Failure physics and analysis, 2006.

26.   C. M. Tan, W. Li, K. T. Tan, and F. Low. “Development of highly accelerated electromigration test,” in European Symp. on Reliability of Electron Devices, Failure physics and analysis, 2006.

27.   W. Li and C. M. Tan. “Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling,” in Symp. on Microelectronics, 2006.

28.   A. Roy, C. M. Tan, R. Kumar, and X. T. Chen. “Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures,” in European Symp. on Reliability of Electron Devices, Failure physics and Analysis, 2005.

29.   C. M. Tan, A. Roy, K. T. Tan, D. S. K. Ye, and F. Low. “Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects,” in European Symp. on Reliability of Electron Devices, Failure physics and Analysis, 2005.

30.   A. Roy and C. M. Tan. “Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure,” in Int. Conf. on Materials for advanced technologies, 2005.

31.   C. M. Tan. “Is electron wind force the sole driving force in electromingration of ULSI interconnection? (invited)” in Int. Conf. on Materials for Advanced Technologies, 2005.

32.   Y. K. Lim, A. Roy, K. L. Pey, C. M. Tan, C. S. Seet, T. J. Lee, and D. Vigar. “Stress migration reliability of wide Cu interconnects with Gouging Vias,” in Int. reliability physics Symp., 2005, pp. 203.

33.   G. Zhang, C. M. Tan, K. T. Tan, K. Y. Sim, and W. Y. Zhang. “Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology,” in European Symp. on Reliability of Electron Devices, Failure physics and analysis, 2004, pp. 1843-1848.

34.   A. Roy, C. M. Tan, V. V. Anand, K. Ahila, G. Zhang, and M. G. Subodh. “Effect of current crowding on copper dual damascene via bottom failure for ULSI applications,” in Int. Symp. on Physical and Failure Analysis of Integrated Circuits, 2004.

35.   A. Roy and C. M. Tan. “Current crowding effect on submicron copper dual damascene via bottom failure,” in Symp. on Microelectronics, 2004.

36.   C. M. Tan and G. Zhang. “Overcoming intrinsic weakness of ULSI metallization on electromigration performances,” in Int. Conf. on Materials for Advanced Technologies, 2003.

37.   H. S. Park, J. K. Low, C. M. Tan, and A. See. “Effects of Cu surface cleanness on electromigration reliability of Cu interconnects,” in Int. Conf. on Materials for Advanced Technologies, 2003.

38.   C. M. Tan and G. Zhang. “Investigation of the physical processes during electromigration of ULSI interconnection (invited),” in ANSYS User Meeting, 2003.

39.   C. M. Tan, A. C. M. Lim, C. T. Y. Tai, G. Zhang, H. S. Park, and S. M. Ong. “Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test,” in JEDEX Conf., 2003.

40.   G. Zhang, C. M. Tan, Z. Gan, K. Prasad, and D. H. Zhang. “Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects,” in Materials Research Society Spring meeting, 2003.

41.   Z. L. Yuan, C. Y. Lia, D. H. Zhang, K. Prasad, C. M. Tan, Y. J. Yuan, P. W. Lu, R. Kumar, and P. D. Foo. “Improvement of Ta diffusion barrier by NH3 plasma pre-treatment,” in Int. Semiconductor Technology Conf., 2002.

42.   Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, C. M. Tan, R. Kumar, and P. D. Foo. “Characterization of a-Ta diffusion barrier for copper metallization,” in VMIC, 2002.

43.   Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, C. M. Tan, Y. J. Yuan, P. W. Lu, R. Kumar, and P. D. Foo. “Cubic Ta diffusion barrier layers for Cu metallization,” in 2nd Int. Semiconductor Technology Conf., 2002.

44.   C. M. Tan, W. L. See, and J. K. C. Tey. “Analysis of electromigration test data,” in IEEE 6th Int. Conf. on Solid-state and Integrated Circuit Technology, 2001, pp. 964.

45.   S. Y. Lim, C. M. Tan, K. Prasad, and D. H. Zhang. “Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis,” in 6th Int. Conf. on Solid-state and integrated circuit Technology, 2001, pp. 921.

 

Nanotechnology

1.   U. Narula, C.M. Tan, “Improvement in Electrical and Thermal Characteristics of Copper using PVD Based Graphene”, 28th International Conference on Diamond and Carbon Materials, Gothenburg, Sweden, 3-7 September 2017.

2.   Udit Narula, Cher Ming Tan, “Engineering a PVD Based Graphene Synthesis Method”, 11th IEEE Nanotechnology Materials and Devices Conference (NMDC 2016), Toulouse, France, 9th-12th October, 2016.

3.   U. Narula, C. S. Lai and C. M. Tan, "Determination of key factors for low temperature graphene synthesis using design of experiments approach," 2016 IEEE International Nanoelectronics Conference (INEC), Chengdu, 2016, pp. 1-2. doi: 10.1109/INEC.2016.7589252

4.   Udit Narula, Cher Ming Tan, Chao Sung Lai, "Design of Experiments for Determination of Key Factors for Graphene Synthesis on Copper Using Amorphous Carbon- a statistical approach," International Conference on Electrical, Electronics, and Optimization Techniques (ICEEOT 2016), Chennai, India – 2016, pp. 869-872. Doi: 10.1109/ICEEOT.2016.7754810

5.   Udit Narula, Cher Ming Tan, Chao Sung Lai,, Thermally Stressed Copper Induced Synthesis of Graphene using Amorphous Carbon,”  8th International Conference on Materials for Advanced Technologies, Singapore, 28 June, 2015.

6.   Udit Narula, C. S.  Lai, C. M. Tan, “Copper Catalyzed Crystallization of Amorphous Carbon into Graphene,” International Electron Devices and Materials Symposium, Hualian, Taiwan, November, 2014.

7.     Cher Ming Tan and Xiangchen Chen, “ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device”, (Invited Talk), to be presented in Collaborative Conference on Materials Research, Korea, 2013.

8.     Xiangchen Chen and Cher Ming Tan, “Modeling and Analysis of Gate-All-Around Silicon Nanowire FET”, to be presented in International Conference on Materials for Advanced Technologies, Singapore 2013.

9.     S. Cheng, C. M. Tan, T. Deng, F. He, S Zhang, and H. Su. “Investigation of work function and surface energy of aluminum - an AB-Initio study,” in 5th IEEE Int. Nanoelectronics Conf., Singapore, 2nd-4th Jan. 2013.

10.   S. H. Chen, C. M. Tan, E. Tan, and J. Kong. “Effects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for ultra high power light-emitting diode,” in 5th IEEE Int. Nanoelectronics Conf., Singapore, 2nd-4th Jan. 2013.

11.   C. M. Tan, C. Baudot, Y. D. Han, and H. Jing. “Applications of multi-walled carbon nanotube (invited),” in IEEE Int. Nanoelectronics Conf., Taiwan, Jun. 2011.

12.   S. H. Chen, C. M. Tan, M. H. Tan, and B. K. Chen. “Performance evaluation of covalently functionalized carbon nano-tube polymer heat sink for ultra high power LED,” in IEEE Int. Nanoelectronics Conf., Taiwan, Jun. 2011.

13.   Y. D. Han, L. Y. Xu, H. Y. Jing, C. M. Tan, S. M. L Nai, and J. Wei. “Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder,” in 60th IEEE Electronic Components and Technology Conf., 2010.

14.   Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. TAN, and J. Wei. “Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth,” in 11th Electronic Packaging Technology Conf., Singapore, 2009, pp. 292-295.

15.   C. Baudot, C. M. Tan, J. Kong, F. Buonocore, and A. Di-Mateo. “Application of FTIR for the study of functional molecules grafting on carbon nanotubes,” presented at Advanced Materials for Nanotechnology, New Zealand, May 2009.

16.   S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, and J. Wei. “Using nanoparticles and carbon nanotubes to enhance the properties of a lead free solder,” in 12th Nanotechnology Conf. & Expo, USA, 2009, pp. 538-541.

17.   C. Baudot, C. M. Tan, and C. Wang. “Nano-tailoring of carbon nanotube as nano-fillers for composite materials applications,” presented at IEEE Int. Nanoelectronics Conf., Shanghai, China, Mar. 2008.

18.   M. Gu, C. Q. Sun, C. M. Tan, and S. Wang. “Methodologies for size, and temperature dependent change of materials properties,” presented at IEEE Int. Nanoelectronics Conf., Shanghai, China, Mar. 2008.

19.   A. Roy, C. M. Tan, S. OShea, and W. Hofbauer. “Room temperature observation of point defect on gold surface using thermovoltage mapping,” in European Symp. on Reliability of Electron Devices, Failure physics and analysis, 2007.

20.   C. M. Tan, J. Jia, L. K. Ang, K. T. Ng, and Y. C. Foo. “Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film,” in 5th IEEE Conf. on Nanotechnology, 2005, pp. 638-641.

21.   L. Huang, S. P. Lau, C. M. Tan, Z. Sun, and B. K. Tay. “Growth of carbon nanotubes using ZrFe catalyst layer and their field emission properties,” in Int. Conf. on Materials for Advanced Technologies, 2003.

 

Devices Reliability

1.     Udit Narula, Cher Ming Tan, "Challenges in Reliability Screening for High Power Diodes", 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017), Chengdu, China, 4-7 July, 2017.

2.     Udit Narula, Cher Ming Tan, "Challenges in Reliability Screening for High Power Diodes", International Workshop on Reliability for Advanced Technology, Taipei City, Taiwan, 16th February, 2017.

3.     C. M. Tan, L. Sun, N. Raghavan, C. Hsu, and C. Wang. “Comparative study of non-standard power diodes,” in IEEE Conf. on Industrial Electronics and Applications, 2009.

4.     G. Huang and C. M. Tan. “Device level electrical-thermal-stress coupled-field modeling,” in European Symp. on Reliability of Electron Devices, Failure physics and analysis, 2006.

5.     G. Huang and C. M. Tan. “Device temperature and stress distributions in power diode - a finite element method,” in Int. Conf. on power electronics and drive systems, 2005, pp. 700-703.

6.     C. M. Tan, J. Chiu, R. Liu, and G. Zhang. “Reliability screening through electrical testing for press-fit alternator power diode in automotive application,” in European Symp. on Reliability of Electron Devices, Failure physics and Analysis, 2005.

7.     C. M. Tan, Z. Gan, W. F. Ho, S. Chen, and R. Liu. “Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications,” in Int. Conf. on power electronics and motion control, 2004.

8.     G. Huang, C. M. Tan, Z. Gan, G. Zhang, W. Yu, and W. Jun. “Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing,” in Int. Symp. on Physical and Failure Analysis of Integrated Circuits, 2004.

9.     C. M. Tan, Z. Gan, W. F. Ho, R. Liu, and S. Chen. “New useful information from simple forward I-V measurement of a power diode,” in 4th Int. Power Electronics and Motion Control Conf., China, 2004.

10.   C. M. Tan, Y. F. Wong, P. H. Teoh, G. Huang. “Improving the reverse blocking capability of carrier stored trench-gate bipolar transistor,” in Int. Conf. on Power Electronics and Drive Systems, 2003.

11.   C. M. Tan and Z. Gan. “Effectiveness of delta VF test to detect solder integrity in power diode,” in Int. Conf. on Power Electronics and Drive Systems, 2003, pp. 38-42.

12.   X. F. Gao, C. M. Tan, and W. L. Goh. “Thermal stress distribution in the SOI structure,” in 8th Int. Symp. on Integrated Circuits, Devices & Systems, 1999, pp. 394-397.

 

Prognosis and Health Mgt

1.     Jung-Hua Tung and Cher Ming Tan, "Predictive Statistical Maintenance and Repair Strategy of Dialysis Machine", International Workshop on Reliability for Advanced Technology, Taipei City, Taiwan, 16th February, 2017.

2.       C. M. Tan, “Recent Development of Reliability and Maintenance (Invited Talk),” in TUV SÜD PSB Testing, Inspection and Certification Conf., Singapore, September, 2012.

3.     C. M. Tan, M. D. Le, and F. Leng. “SoC and SoH Estimation of battery cell and modules for electric vehicles (Keynote Talk),” in IEEE Annual PHM Conf., Beijing, China, 22nd-24th May 2012.

4.     C. M. Tan, M. D. Le, and F. Leng. “Estimation of SoC/SoH of cell and RUL of battery pack for EV Application (Invited Talk),” in IEEE Battery Management Systems for High Operational Availability and Safety Conf., Shenzhen, China, 21st May 2012.

5.     C. M. Tan. “Recent Development of Reliability and Maintenance (Invited Talk),” in TUV SÜD PSB Testing, Inspection and Certification Conf., Singapore, Sep. 2012.

6.     C. M. Tan and M. D. Le. “Contamination Assessment of Inductive Couple Plasma Etching Chamber under Mixture of Recipes using Statistical Method,” in IEEE Electron Devices and Solid State Circuits, China, 2011.

7.     Cher Ming Tan, Minh Duc Le and Nagarajan Raghavan, , 2010, “Predictive maintenance model for multi-state systems with multiple failure modes and dependent element failure under imperfect maintenance”, in IEEE Prognostics and Health Management Conference, USA, p1-12

8.     C. M. Tan and N. Raghavan. “Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency,” in Prognostics & System Health Management Conf., Macau, 2010, pp. MU3006.

9.     C. M. Tan and N. Raghavan. “A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry,” in Advanced Process control for semiconductor Manufacturing, 2006.

10.   C. M. Tan and N. Raghavan. “A cost model for the predictive maintenance policy of a multi-state system,” in 10th Maintenance and Reliability Conf., 2006.

11.   N. Raghavan and C. M. Tan. “Examine the impact of maintenance policy for predictive maintenance,” in Int. Conf. on Quality and Reliability, 2005, pp. 745-752.

12.   C. M. Tan. “Maintenance policy for predictive maintenance (invited),” presented at 6th Annual Plant Reliability and Maintenance, Kuala Lumpur, Dec. 2005.

13.   C. M. Tan. “Predictive maintenance and its impact to business decision (invited),” presented at Strategic Maintenance Congress, Dec. 2005.

14.   C. M. Tan, B. K. Khoo, and J, Png. “Determining maintenance strategy from root cause analysis and reliability data analysis (invited),” presented at Annual Reliability, Availability, Maintainability and Safety Conf., Kuala Lumpur, Jun. 2004.

15.   C. M. Tan, B. K. Khoo. “Application of FMEA for build-in reliability and maintenance (invited),” presented at Industrial Talk, 2004.

 

Wafer Bonding

1.     C. M. Tan, W. B. Yu, and J. Wei. “Making wafer bonding viable for mass production,” in Materials Research Society Spring Meeting, 2005.

2.     J. Wei, S.S. Deng, C.M. Tan,Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature,” in  American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v 5, p 225-229, 2005, Electronic and Photonic Packaging, Integration and Packaging of Micro/Nano/Electronic Systems – 2005

3.     G. Huang, C.M. Tan, Z. Gan, W. Jun, G. Zhang, W. Yu,Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing,” in  Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743), p 189-92, 2004

4.     J. Wei, S. S. Deng, C. M. Tan, and C. K. Wong. “Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer,” in IEEE Electronics Packaging Technology Conf., Singapore, 2004.

5.     S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, and H. Xie. “Low temperature wafer bonding process using sol-gel intermediate layer,” in Int. Mechanical Engineering Congress and Exposition, 2004.

6.     W. B. Yu, J. Wei, C. M. Tan, and S. S. Deng. “Low temperature wafer bonding in medium vacuum,” in Int. Mechanical Engineering Congress and Exposition, 2004.

7.     S. S. Deng, J. Wei, C. M. Tan, and W. B. Yu. “Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer,” in Thin Film and Nanotech, 2004.

8.     S. S. Deng, C. M. Tan, J. Wei, S. M. L. Nai, and W. B. Yu. “Silicon-to-silicon wafer bonding efficiency by sol-gel process,” in 5th Electronics Packaging Technology Conf., 2003.

9.     W. Yu, C. M. Tan, J. Wei, S. Deng, and S. M. L. Nai. “Influence of plasma treatment and cleaning on vacuum wafer bonding,” in 5th Electronics Packaging Technology Conf., 2003.

10.   S. S. Deng, J. Wei, C. M. Tan, S. M. L. Nai, H. Xie, and W. B. Yu. “Low temperature silicon wafer bonding by sol-gel processing,” in Int. Conf. on Materials for Advanced Technologies, 2003.

11.   W. Yu, C. M. Tan, and G. Zhang. “Influence of super-thin oxide layer on device fabricated on partial SOI substrate,” in Int. Conf. on Materials for Advanced Technologies, 2003.

12.   W. Yu, J. Wei, C. M. Tan, S. Deng, and S. M. L. Nai. “Influence of applied load on wafer bonding in vacuum,” in Int. Conf. on Materials for Advanced Technologies, 2003.

 

Integrated Circuit Reliability

1.     Cher Ming Tan*, Dipesh Kapoor and Vivek Sagawan, “Effect of ULSI Interconnect layout on its Electromagnetic Emission”, International Conference on Solid-State and Integrated Circuit Technology, Hangzhou, China, 25-28 Oct., 2016.

2.     Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan*, “Simulation of EMI at Design Level for Integrated Circuits”, APEMC 2016 7th Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition, Shenzhen, China, May 18-21, 2016.

3.     C. M. Tan and F. He. “3D electromigration modeling at circuit level (Invited Talk),” in Taiwan ESD and Reliability Conf., Hsinchu, Taiwan, 5-7th Nov. 2012.

4.     C. M. Tan. “Physics of electromigration in today ULSI interconnections (Tutorial),” in Taiwan ESD and Reliability Conf., Hsinchu, Taiwan, 5-7th Nov. 2012.

5.     S. Lan, C. M. Tan, and K. Wu. “Reliability study of LED driver - a case study of black box testing,” in 23rd European Symp. on Reliability of Electron Devices, Failure Physics and Analysis, Cagliari, Italy, 1st-5th Oct. 2012.

6.     F. He and C. M. Tan. “Effect of IC layout on the reliability of CMOS amplifiers,” presented at Int. Conf. on Materials for Advanced Technologies, Singapore, Jul. 2011.

7.     C. M. Tan and F. He. “3D circuit model for 3D IC reliability study (invited),” in EuroSIME, 2009.

8.     C. M. Tan and F. He. “Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data,” in Int. Symp. on Integrated Circuits, Singapore, 2007.

 

Failure Analysis

1.     C. M. Tan, S. Yanuar, and T. C. Chai. “Finite element modeling of capacitive coupling voltage contrast,” in European Symp. on Reliability of Electron Devices, Failure physics and analysis, 2007.

2.     C. M. Tan, Y. X. Tay, C. W. Goh, and T. C. Chai. “Mapping of solder mask covered interconnects on high density printed circuit board,” in Electronic Packaging and Technology Conf., 2006.

3.     C. M. Tan, T. C. Chai, J. Lim, and K. P. Lim. “Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist,” in European Symp. on Reliability of Electron Devices, Failure physics and Analysis, 2005.

4.     K. P. Lim, J. Lim, C. M. Tan, and T. C. Chai. “Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board,” in Symp. of Microelectronics, 2005.

5.     C. M. Tan, Z. Gan, K. Prasad, and D. H. Zhang. “A novel technique to re-construct three dimensional void in passivated metal interconnects,” in Materials Research Society Spring Meeting, 2003.

6.     Z. Gan, C. M. Tan, K. Prasad, D. H. Zhang, and G. Zhang. “Novel rapid nondestructive technique for locating tiny voids in metallization line,” in Int. Microscopy and Microanalysis Conf., 2002.

 

Reliability Statistics

1.     N. Raghavan and C. M. Tan. “Statistical modeling of via redundancy effects on interconnect reliability,” in IEEE Int. Conf. on Physical and Failure Analysis, 2008.

2.     C. M. Tan and N. Raghavan. “An approach to statistical analysis of gate oxide breakdown mechanisms,” in European Symp. on Reliability of Electron Devices, Failure physics and analysis, 2007.

3.     N. Raghavan and C. M. Tan. “Statistical analysis of multi-censored electromigration data using the EM algorithm,” in Int. Symp. on physical and failure analysis of integrated circuits, 2007.

4.     C. M. Tan, V. A. Anand, G. Zhang, A. Krishnamoorthy, and S. Mhaisalkar. “New analysis technique for time to failure data in copper electromigration,” in JEDEX Conf., 2005.

5.     C. M. Tan. “Reliabiilty Analysis and Application with MATLAB (invited),” presented at Industrial seminar, May 2004.

6.     Cher Ming Tan, “Reliability Data Analysis”, (Keynote) IEEE Invited talk organized by Rel/CPMT/ED chapter, 2002.

7.     C. M. Tan and K. N. C. Yeo. “Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT),” in IEEE Canadian Conf. on Electrical and Computing Engineering, 2000, pp. 167-172.

8.     G. Zhang and C. M. Tan. “Selection of failure time within test time interval for group reliability data analysis,” in IEEE Canadian Conf. on Electrical and Computing Engineering, 2000, pp. 98-102.

9.     G. Zhang and C. M. Tan. “Reliability data analysis software development,” in IEEE Canadian Conf. on Electrical and Computing Engineering, 2000, pp. 107-115.

 

LED Reliability

1.     Preetpal Singh and Cher Ming Tan, "Thermal-humidity degradation mechanisms of silicone in LED Packaging under different environmental conditions", International Workshop on Reliability for Advanced Technology, Taipei City, Taiwan, 16th February, 2017.

2.     Preetpal Singh, Cher Ming Tan, “Investigation of LED lumen recovery after the sharp initial lumen degradation using ANSYS finite element modeling and C-SAM”, 2016 Taiwan ESD and Reliability Conference, Hsinchu, Taiwan, Oct. 31-Nov. 2, 2016.

3.     Preetpal Singh, Chao Sung Lai, Cher Ming Tan, “Graphene as a buffer layer for high quality GaN deposition on substrates in electronics”, The 5th International Symposium on Next-Generation Electronics, Hsinchu, Taiwan, 3-6 May, 2016.

4.     Preetpal Singh, Cher Ming Tan, "Dependence of test conditions on humidity reliability results for high power LEDs", 8th International Conference on Materials for Advanced Technologies, Singapore, 28 June, 2015.

5.     Cher Ming Tan and Preetpal Singh, “Exploring the Humidity Effect on the Reliability of High Power LEDs”, (Invited talk) International Electron Devices and Materials Symposium, Hualian, Taiwan, November, 2014.

6.     Lan Song and Cher Ming Tan, “Reliability Evaluation and Improvement for High Power LED Driver”, International Conference on Materials for advanced Technologies, Singapore, 30 June, 2013.

7.     C. M. Tan. “Study of humidity reliability of solid state lighting (Invited Talk),” in LED Display and Lighting System Symp., Shenzhen, China, 18-19th Jul. 2012.

8.     S. H. Chen, C. M. Tan, and G. H. Tan. “Degradation behaviour of high power light emitting diode under high frequency switching,” in 23rd European Symp. on Reliability of Electron Devices, Failure Physics and Analysis, Cagliari, Italy, 1st-5th Oct. 2012.

9.     S. H. Chen, C. M. Tan, and E. Chen. “Ensuring Accuracy in Optical and Electrical Measurement of Ultra-Bright LEDs during Reliability Test,” presented at Int. Conf. on Materials for Advanced Technologies, Singapore, Jan. 2011.

10.   C. M. Tan, B. K. Chen, and M. Xiong. “Study of humidity reliability of high power LEDS (invited),” in IEEE Int. Conf. on Solid-State and Integrated Circuit Technology, Shanghai, 2010, pp. 1592-1595.

11.   C. M. Tan, B. K. Chen, R. Tew. “Humidity effect on the degradation of packaged ultra-bright white LEDs,” in IEEE Electronics Packaging Technology Conf., 2008.

 

Quality

1.     C. M. Tan and K. T. Lau. “Automated wafer defect map generation for process yield improvement,” in Int. Symp. on Integrated Circuits, Singapore, 2011.

2.     C. M. Tan. “Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (invited),” presented at Int. Quality and Process control Conf., Bangkok, Jan. 2004.

3.     T. K. Neo and C. M. Tan. “QFD implementation in a discrete semiconductor industry,” in IEEE Annual Reliability and Maintainability Symp., 2002, pp. 484-489.

4.     C. M. Tan and G. Zhang. “A new quality control parameter in wafer fabrication for wire bonding integrity,” in SPIE on Microelectronic Yield, Reliability and Advanced Packaging, 2000.

5.     T. K. Neo and C. M. Tan. “Integrating device modeling in QFD implementation for power electronics applications,” in IEEE Canadian Conf. on Electrical and Computing Engineering, 2000, pp. 1187-1191.

6.     C. M. Tan. “Computerization of quality control in electronics components industry,” in National Quality Management Conf., 1995.

 

Remanufacturing

1.     F. He and C. M. Tan, “Monte Carlo simulation of fatigue crack initiation at elevated temperature,” in 13th Int. Conf. on Fracture, Beijing, China, 16th-21st Jun. 2013.

 

Battery

1.     Cher Ming Tan, Leng Feng, “Internal probing into the degradation processes in Lithium-ion batteries under cyclic aging”, Invited talk, 1st International battery Safety Workshop, Munich, Germany, August, 2015.

2.     Cher Ming Tan, Leng Feng, "Li Ion Battery Pack Reliability Assurance", 4th international symposium on energy challenges and mechanics - working on small scale, Scotland, UK, 11-13 August, 2015.

3.     Feng Leng and Cher Ming Tan, “A methodology for studying the effect of overcharge on the safety of lithium-ion batteries”, Invited talk, 5th Annual Battery Safety Conference, Washington, USA, 2014.

4.     Feng Leng, Cher Ming Tan, Raghavendra Arunachala, Andreas Jossen, “Real Time Monitoring and Characterizing of Li-ion Batteries Aging”, Advanced Energy Technology Congress, San Diego, USA, 2013.

 

General Reliability

1.       Cher Ming Tan, Udit Narula, Dipesh Kapoor, "Reliability Paradox for Worldwide Automotive Electronics", 63rd Annual Reliability & Maintainability Symposium (RAMS), Orlando, FL, USA, 23-26 January, 2017.

 

Others

1.     J. Zhang, X. Y. Zhang, Z. L. Chen, K. Y. See, C. M. Tan, and S. S. Chen. “On-chip RF energy harvesting circuit for image sensor,” in Int. Symp. on Integrated Circuits, 2011, pp. 420-423.

2.     J. W. Zhang, L. B. Wang, K. Y. See, C. M. Tan, C. C. Boon, K. S. Yeo, and M. A. Do. “Wireless energy harvesting using serially connected voltage doublers,” in Asia-Pacific Microwave Conf., Yokohama, Japan, 2010.

3.     C. M. Tan, K. Y. See, J. W. Zhang, M. J. Xu, C. C. Boon, K. S. Yeo, and M. A. Do. “A possible reality on battery-less low-power portable electronics,” in IEEE Conf. on Industrial Electronics and Applications, Taichung, Taiwan, 2010, pp. 630-633.

4.     Z.J. Han, M. Shakerzadeh, B.K. Tay, C.M. Tan, Protein immobilization on nanostructured surfaces with different wettability,”  in 2010 IEEE 3rd International Nanoelectronics Conference (INEC 2010), p 1 pp., 2010

5.     Y. Hou and C.M. Tan. “Transient electrical thermal analysis of ESD process using 3-D finite element method,” in 12th IEEE Int. Symp. on Integrated Circuits, Singapore, 2009.

6.     C. M. Tan, E. Q. Kuan, and R. Cai. “The influence of Nano TiO2 film thickness on its photo-catalytic and hydrophilic properties,” presented at Advanced Materials for Nanotechnology, New Zealand, May 2009.

7.     C. M. Tan. “Extending the useful life of solar cell through Nano TiO2 film coating,” presented at Advanced Materials for Nanotechnology, New Zealand, May 2009.

8.     C. M. Tan, L. Sun, and C. Wang. “Going green for discrete power diode manufacturing,” presented at IEEE ICIEA2009, Xi'an, China.

9.     I. V. McLoughlin, A. M. Prakash, S. Shukla, S. H. Tan, K. Arichandran, C. M. Tan, V. S. Sawant, and R. K. Manchanda. “Use of high altitude balloon platforms for small satellite testing,” in IEEE Int. Workshop on Digital infoTainment and Visualization, 2008, pp. 1-5.

10.   C. M. Tan, L. Sun, N. Raghavan, G. Huang, C. Hsu, and C. Wang. “The physical limit and manufacturability of power diode with carrier lifetime control,” in Int. Conf. on industrial electronics and applications, 2007.

11.   N. Raghavan, N. Hwang, and C. M. Tan. “A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs,” in 8th Int. Conf. on Solid-State and Integrated Circuit Technology, 2006, pp. 139-142.

12.   C. M. Tan and Z. Gan. “Building empirical model through simulation a case study,” in Int. Conf. on Engineering Management, 2004, pp. 1090-1094.

13.   C. M. Tan, Y. H. Sng, and H. K. Tang “Industry-university R&D collaboration: expectation and reality,” in Int. Conf. on Engineering Management, 2004, pp. 626-629.

14.   Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, L. J. Tang, C. M. Tan, R. Kumar, and P.D. Foo. “Study of interaction between a-Ta films and SiO2 under rapid thermal annealing,” in Int. Conf. on Materials for Advanced Technologies, 2003.

15.   K. Prasad, X. L. Yuan, C. M. Tan, D. H. Zhang, C. Y. Li, S. R. Wang, S. Y. J. Yuan, J. L. Xie, D. Gui, and P. D. Foo. “Diffusion studies of Cu in Si and low-k dielectric materials,” in Materials Research Society Spring Meeting, 2002.

16.   S. Zukotynski, F. Gaspari, N. Kherani, T. Kosteski, K. Law, W. T. Shmayda, and C. M. Tan. “Metastability in tritiated amorphous silicon,” in 19th Int. Conf. on Amorphous and Microcrystalline Semiconductors Science & Technology, 2001.

17.   K. Prasad, D. H. Zhang, C. M. Tan. “Backside copper contamination issues in CMOS integrated circuits,” in Int. workshop on physics of semiconductor devices, 2001.

18.   S. W. Loh, D. H. Zhang, C. Y. Li, R. Liu, A. T. S. Wee, K. Prasad, C. M. Tan, Y. K. Lee, P. D. Foo, and J. Xie. “Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures,” in Int. Semiconductor Technology Conf., 2001, pp. 116-122.

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